研发成果获国际会议发表

  1. 《Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array 》2019 年 4 月 @泰国.曼谷 14th IEEE-NEMS
  2. 《Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure 》2019 年 4 月 @泰国.曼谷 14th IEEE-NEMS
  3. 《Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics 》2019 年 4 月 @泰国.曼谷 14th IEEE-NEMS
  4. 《Study of properties of AlN pMUT used as a wireless power receiver 》2019 年 5 月 @美国.拉斯维加斯 69th IEEE-ECTC

已取得专利

  • 《晶圆级超声波晶片规模制造及封装方法》专利号:I661493
  • 《晶圆级超声波晶片模组及其制造方法》专利号:I675498