Results of R&D Published in international conferences
《Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array 》April 2019 @Thailand.Bangkok 14th IEEE-NEMS
《Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure 》April 2019 @Thailand.Bangkok 14th IEEE-NEMS
《Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics 》April 2019 @Thailand.Bangkok 14th IEEE-NEMS
《Study of properties of AlN pMUT used as a wireless power receiver 》May 2019 @United States.Las Vegas 69th IEEE-ECTC
Patents Granted
Patent number for “Wafer-class Ultrasonic Chip Fabrication and Packaging Method” Patent No: I661493
“Wafer-class Ultrasonic Chip Module and Fabrication Method” Patent No:I675498
“Wafer-class Ultrasonic Device” Patent No:M595789
“Wafer-class Ultrasonic Chip Module Component and Fabrication Method” Patent No:I692888
“ULTRASONIC MODULE AND METHOD FOR MANUFACTURING” Patent No:US 10657349 B2