Results of R&D Published in international conferences

  1. 《Effect of Shared Cavity on Electromechanical Performance of Piezoelectric Based Micro-machined Ultrasonic Transducer Array 》April 2019 @Thailand.Bangkok 14th IEEE-NEMS
  2. 《Fabrication Process and Performance Analysis of AlN based Piezoelectric Micromachined Ultrasonic Transducer with a Suspended Structure 》April 2019 @Thailand.Bangkok 14th IEEE-NEMS
  3. 《Thermal Effect of PMUT and Its Application to the Heat Dissipation of Power Electronics 》April 2019 @Thailand.Bangkok 14th IEEE-NEMS
  4. 《Study of properties of AlN pMUT used as a wireless power receiver 》May 2019 @United States.Las Vegas 69th IEEE-ECTC

Patents Granted

  • Patent number for “Wafer-class Ultrasonic Chip Fabrication and Packaging Method” Patent No: I661493
  • “Wafer-class Ultrasonic Chip Module and Fabrication Method” Patent No：I675498
  • “Wafer-class Ultrasonic Device” Patent No:M595789
  • “Wafer-class Ultrasonic Chip Module Component and Fabrication Method” Patent No：I692888
  • “ULTRASONIC MODULE AND METHOD FOR MANUFACTURING” Patent No：US 10657349 B2
  • “Wafer-class Ultrasonic Chip Device” Patent No：ZL 2019 2 2293014.8